Ultra-high thermal conductivity
Phase-change mechanism delivers far higher conductivity than metals for rapid cooling
Vapor Chamber
A vacuum-sealed cavity with micro-structured inner walls, typically made of copper—the core component responsible for heat transfer within the cooling module
Features
01
Uniform temperature distribution
2D planar spreading prevents hot spots and ensures even chip surface temperature
02
Ultra-thin design
Customizable down to millimeters—ideal for slim electronics
03
Flexible shape adaptation
Supports custom contours (L-shape, polygonal, etc.)
04
High reliability
Vacuum-sealed structure maintains performance under high temp and vibration
05
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